Features:
1.It is developed and designed for the repair of large industrial control motherboards, 5G server motherboards, etc. (the maximum splint area is 1200mmX700mm), and it is fully computer controlled.
2.Integrated design of heating head and placement head, with automatic rotation, alignment, welding and automatic disassembly functions
3.The ultra-large bottom infrared preheating platform adopts the German imported Erstein dark infrared heating plate, which heats up quickly, preheats evenly, and the preheating area reaches 650*520 mm.
4.Equipped with a nitrogen inlet port, which can be externally protected by nitrogen for welding, making rework safer and more reliable
5.10-stage up (down) temperature + 10-stage constant temperature control, various sizes of alloy hot air nozzles, easy to replace Application: Mainly used in the rework of BGA, CSP, POP, LGA and other components of base stations, servers, and industrial control boards in the communication industry.
Specification:
Model I.C.T-BR1250
Maximum PCB size: 1200*750mm
Repairable range: POP,BGA,LED,CCGA,QFN,CSP,LGA,Micro SMD,MLF;
Applicable chips Min: 0.*0.6 mm--Max 100*100mm
Applicable chip min pitch: 0.15mm
PCB Thickness: 0.5~8mm
Mounting Max Weight: 1000g
Mounting accuracy: ±0.01mm
Mounting pressure: <0.2N
Temperature control method K-type thermocouple closed loop control
Temperature accuracy: ±1?
Temperature measurement interface: 13
Optical alignment system: Industrial 8MP HDMI HD Camera
Top hot air heater power: 1500W
Bottom hot air heater power: 1500W
Bottom preheat power: 1200W
Bottom preheating heating plate 20 ceramic heating plates
Control part power: 500W
Total power Max: 1550W
Power supply: AC380V, 50/60Hz
Dimension: L2000*W1500*H1870mm
Weight: 1350KG
* I.C.T keeps working on quality and performance, specifications and appearance may be updated without particular notice.