Product:
From zero to 240 °C due to optimized heat transfer
Each product has its own requirements in the manufacturing process. Optimized heat transfer over the entire soldering process is the basis for
best possible results.
The LV-Series offers flexibly controllable preheating zones within which your PCB is preheated and prepared for the actual soldering process.
The individual zones can be controlled independently of each other via fan frequency, and assure best possible processes.
The LV-Series is equipped with special nozzle sheets for optimized heat transfer by means of uniform air flow over the PCBs. Flow speeds in the upper and lower heat zones can be separately controlled, assuring that your PCB is heated up.
Saddle profile
The component is brought to a temperature of at least 240 °C for soldering. Using a saddle profile, the board is gradually heated in line with pre-defined, individual temperature ranges. Even components with differing thermal masses are heated homogeneously and temperature differences minimized.
Linear profile
With a linear profile, the component is not heated in a stepped manner during soldering, in fact it is heated along an identical linear temperature gradient. Linear profiles can reduce cycle times and can help to reduce soldering errors such as tomb stoning
Heating System
Transport System
Vacuum System
Effective Residue Management
As is the case with all industrial processes, substances are generated during SMT production which have to be removed from the process cycle because they contaminate the system. Our highly effective residue management function purifies the process gas safely and reliably and keeps your system clean and dry.
Cooling System
Stress-free cooling using individually adjustable ventilators.
Gentle cooling through extended cooling tract
Flexible combination possibilities through a range of different options
New, sustainable cooling principle as a result of liquid nitrogen cooling
SPECIFICATIONS:
