The I.C.T dispensing system has significant strength in cost performance. Being reliable, durable, and concisely designed, it can be applied to PCB and base materials of different specifications. The UFD operating software ensures the stability and reliability of the system. The system is designed for chip sealing, PCB assembly, SMT red glue dispensing, led lens, and medical products. With adjustable track width, it can be applied to more products. axxon has established wide support and service network to provide complete process solution for the development, manufacturing and product innovation of the customers.

Features:

- High cost performance;

- Non-contact jet valve to realize smaller dispensing diameter and wider application area

- Jet valve can improve the reliability and uniformity of dispensing, and improve the output and material utilization rate;

- Minimum width of excessive glue can be controlled in 0.2mm(related to the configuration and glue);

- Chip edge identification is much more accurate than mark-point identification.

- ID identification, automatic program calling, fool-proofing and data statistics function helps to realize smart manufacturing

Application:

• Underfill • Led lens • Pin encapsulation • Conformal coating • Edge/corner bonding • Surface mounted package • Package on package (POP) • Dam & fill • Red glue dispensing • FPC reinforcement

Features:

1.Core part--jet valve:

• Non-contact jet dispensing;

• High speed; max jet speed: 200 spots/second, 3-7 times higher than the traditional dispensing;

• High accuracy; Min dispensing volume can be 5nl, with consistancy the traditional dispensing method

• Highly flexible; Non-contact to avoid the interference between needle and workplace; extremely small dispensing volume;

• Low maintenance cost and long service life

• Advanced mechanical design makes routine cleaning and maintenance easy; most advanced nanometer wear-resistant material • Own independent intellectual property rights;

• Thermostatic system for flow channel and sprayer to ensure the uniformity in glue temperature;

• the uniformity in glue temperature

2.Enhance the capacity:

• Non-contact jet dispensing to eliminate  the time for Z-axis motion;

• Non-contact jet speed: 200 spots/second;

• Integrated temperature control technology to reduce the manual intervention;

• Automatic glue compensation, and reduced artificial regulation time;

• Dual-track design to cut down waiting time;

• Automatic visual location identification and compensation;

• Non-contact height detection with laser to reduce the height detection time;

3.Flexibility:

• Capable of handling substrates or backings of a variety of sizes in order to adapt to requirements of a variety of customers;

• Heating module optional;

• Dual-track in independent control, software is easy to operate;

• Enable to realize fast switching between different product-line;

• Universal platform used for different processes with different glues.